TY  - BOOK
AU  - Wong,C.P.
AU  - Lu,Daniel
TI  - Materials for advanced packaging
SN  - 9780387782188
U1  - 621.381046 23
PY  - 2016///
CY  - New York, NY
PB  - Springer Science+Business Media
KW  - Packaging
KW  - Materials
KW  - Microelectronic packaging
N1  - Includes index
ER  -