| 000 | 01055cam a2200325 i 4500 | ||
|---|---|---|---|
| 001 | 19327000 | ||
| 003 | OSt | ||
| 005 | 20221129124515.0 | ||
| 008 | 161005s2016 nyua b 001 0 eng d | ||
| 010 | _a 2016955826 | ||
| 020 |
_a9780387782188 _qhardcover |
||
| 040 |
_aDLC _beng _cDLC _erda _dDLC _dUOC |
||
| 042 | _apcc | ||
| 082 | 0 | 0 |
_a621.381046 _223 _bDAN |
| 245 | 0 | 0 |
_aMaterials for advanced packaging / _cDaniel Lu, C. P. Wong |
| 264 | 1 |
_aNew York, NY : _bSpringer Science+Business Media, _c2016. |
|
| 264 | 4 | _c© Springer Science + Business Media, LLC 2009. | |
| 300 |
_axii, 719 pages : _billustrations ; _c24 cm. |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_aunmediated _bn _2rdamedia |
||
| 338 |
_avolume _bnc _2rdacarrier |
||
| 500 | _aIncludes index. | ||
| 650 | 0 |
_aPackaging _xMaterials. _92718 |
|
| 650 | 0 |
_aMicroelectronic packaging. _92719 |
|
| 700 | 1 |
_aWong, C. P., _d1947- _eeditor. _9579 |
|
| 700 | 1 |
_aLu, Daniel _eeditor. _9578 |
|
| 906 |
_a0 _bibc _corignew _d2 _eepcn _f20 _gy-gencatlg |
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| 942 |
_2ddc _cBK |
||
| 999 |
_c114 _d114 |
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