Materials for advanced packaging / Daniel Lu, C. P. Wong
Material type:
TextPublisher: New York, NY : Springer Science+Business Media, 2016Copyright date: © Springer Science + Business Media, LLC 2009Description: xii, 719 pages : illustrations ; 24 cmContent type: text Media type: unmediated Carrier type: volumeISBN: 9780387782188Subject(s): Packaging -- Materials | Microelectronic packagingDDC classification: 621.381046
| Item type | Current location | Call number | Materials specified | Status | Date due | Barcode |
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NB-Book
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EDIN-LIBRARY | 621.381046 DAN/NB (Browse shelf) | Not for loan | 00000204 |
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| 621.381 SER/NB Future trends in microelectronics : From nanophotonics to sensors and energy / | 621.381045 JAS/NB Optoelectronics : an introduction to materials and devices / | 621.381045 MOT/NB Progress in nano-electro-optics VII : Chemical, Biological, and Nanophotonic Technologies for Nano-Optical Devices and Systems / | 621.381046 DAN/NB Materials for advanced packaging / | 621.3813 AHM/NB Microwave engineering : concepts and fundamentals / | 621.3815 HAN/NB Silicon-On-Insulator Modulators for integrated optics application / | 621.3815 RIC/NB Microelectronic circuit design / |
Includes index.
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